cas 7440-05-3 pd nanopowder 초 미세 팔라듐 촉매제
크기 : 20-30nm 순도 : 99. 95 % CAS 번호 : 7440-05-3 에니 넥 번호. : 231-115-6 외관 : 흑색 화약 모양 : 구형
13929258449
크기 : 20-30nm 순도 : 99. 95 % CAS 번호 : 7440-05-3 에니 넥 번호. : 231-115-6 외관 : 흑색 화약 모양 : 구형
고객의 요구 사항에 따라 니오븀 규화물 분말의 다양한 크기의 제품을 공급할 수 있습니다. 크기 : 1-3um; 순도 : 99.5 %; 모양 : 과립 CAS 번호 : 12034-80-9; 에니 넥 번호. : 234-812-3
ni2si 입자, 99.5 % 순도, 입상 형태, 마이크로 전자 집적 회로, 니켈 실리사이드 필름 등에 사용됨 크기 : 1-10um; CAS 번호 : 12059-14-2; eninec 번호. : 235-033-1
buy filling material used spherical silicon dioxide silica sio2 powder, we also have other Size:10-20nm, 20-30nm, 100nm, 300nm, 1-3um, high quality, low price and fast delivery, if you have any interesting, please feel free to contact us.
상표:
SAT NANO제품 번호.:
OP1408B-500N지불:
TT, Paypal, WU제품 원산지:
China색깔:
White Powder배송 포트:
Shenzhen, Shanghai리드 타임:
1-5days최소 주문:
1kgspecification of spherical silica powder
cas No:14808-60-7 ENINEC No.:231-545-4
Appearance:white powder
Shape:spherical
Purity:99.9%
Size: 300nm, 500nm, 1-3um, 5um, 10um, 20um
What are the advantages of spherical silica: first of all, the surface of the ball has good fluidity, and it is evenly mixed with the resin to form a film. The amount of resin added is small, and the fluidity is the best. The filling amount of powder can reach the highest, and the weight ratio can reach 90.5%. Therefore, spheroidization means an increase in the filling rate of silicon micropowder. The higher the filling rate of silicon micropowder, the smaller the thermal expansion coefficient and the lower the thermal conductivity, and the closer to the thermal expansion coefficient of single crystal silicon. The performance of the device is also better. Secondly, the spheroidized plastic molding compound has the least stress concentration and the highest strength.
When the stress concentration of the angular powder molding compound is 1, the stress of the spherical powder is only 0.6. Therefore, when the spherical powder molding compound encapsulates the integrated circuit chip, the yield rate High, and it is not easy to produce mechanical damage during transportation, installation and use. Third, the spherical powder has a small friction coefficient and less wear on the mold, which makes the mold have a long service life. compared with the angular powder, the service life of the mold can be doubled. The packaging mold of the plastic compound is expensive, and some imports are also needed, which reduces costs for packaging plants and improves economic efficiency.